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5W uv laser marking machine

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1. Ultraviolet laser has extremely small focusing spot and small heat-affected zone, so it can carry out ultra-fine marking, which is the product of choice for customers who have higher requirements for marking effect

2. In addition to copper materials, UV lasers are more suitable for processing;

3. Not only the quality of the beam is good, but the focus spot is smaller, and ultra-fine marking can be achieved;

4. The scope of application is more extensive; the heat affected area is extremely small, there will be no thermal effect, and no burning problem of materials

5. Fast marking speed and high efficiency; The machine has stable performance, small size, and low power consumption;

We could not find any corresponding parameters, please add them to the properties table
model MSDB-3W MSDB- 5W
Laser power 3W 5W
Laser wavelength 355nm 355nm
Minimum line width 0.01mm 0.01mm
Smallest character 0.1mm 0.1mm
Power stability (12H) ( 12h)<1.5 ( 12h)<1.5
Pulse repetition frequency 100KHz 100KHz
Peak power 125uj/10kw 125uj/10kw
electricity demand 220V/50HZ 220V/50HZ
frequency 20- 100KHz 20- 100KHz
cooling method Air-cooled / Air Air-cooled / Air
Marking range 100mm * 100mm (optional) 100mm * 100mm (optional)
Operating temperature +10 to +30°C ( 46to 95 of) +10to+30°C(46to95of)
Marking speed ≤15000mm/s ≤1 5000mm/s


   5W UV laser marking machine belongs to the series of laser marking machines. It incorporates international advanced technology. High-energy ultraviolet photons directly destroy the molecular bonds on the surface of many non-metallic materials and cause molecules to escape from objects. This method does not produce high Heat, ultraviolet laser spot light is very small, and there is almost no damage caused by thermal effects during processing, so it is called cold processing. The UV laser marking machine is developed using a 355nm UV laser. This machine uses third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355 UV light focusing spot is extremely small, which can greatly reduce the mechanical deformation of the material and the processing heat effect is small, because it is mainly used for ultra-fine marking and engraving, and is particularly suitable for food and pharmaceutical packaging materials Marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers!      



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SuzhouYosoon laser equipment Co.,Ltd

Focus on the application and development of the laser industry

Innovation is the source of enterprise development

Business integrity, win-win cooperation

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Address: No. 31 Tangxi Road, Huqiu District, Suzhou City

Tel:Vivian Yu +86(0)18896540037 (wechat/whatsapp/mobile)

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